Beneath Heat 22 mm T&G Foiled Chipboard Over Joists UFH System - Underfloor Heating System
Verified by manufacturer 9 months ago
Underfloor heating (UFH) system with grooved T&G foiled P5 grade chipboard fixed to the top of joists, becoming a structural floor deck once a minimum of 6 mm ply is fixed on top.
Application
Underfloor heating (UFH) system for use over timber joists, in new builds and renovation.
Description
Underfloor heating (UFH) system with grooved T&G foiled P5 grade chipboard fixed to the top of joists, becoming a structural floor deck once a minimum of 6 mm ply is fixed on top.
Features and benefits:
- High thermal performance with foil-covered chipboard.
- Good heat retention (low thermal conductivity).
- Can be used on an acoustic system on separating floors.
- Separation layer of 6 mm ply is recommended before applying floor finish (engineered wood or laminate can sit directly on top of the chipboard).
- Note that insulation is required between the joists to current Building Regulations.
- Available in 150 and 200 mm pipe centres.
- Compatible with 16 mm-diameter PERT and MLCP pipes.
- Heating performance*:
- 150 mm pipe centres: 69 W/m².
- 200 mm pipe centres: 65 W/m².
*Heat output at a flow water temperature of 45°, based on a tog rating of 1 with a room temperature of 21°. Consult manufacturer's literature for full details.
General information
Color | Silver Guidance for specification option: Chipboard only. |
Finish | Foil Guidance for specification option: Chipboard only. |
Material | Chipboard Guidance for specification option: P5 grade. |
Shape | Rectangle |
Length | 1200 mm |
Width | 600 mm |
Height | 22 mm |
Warranty description | Two year Guidance for specification option: Electrical and mechanical products. 50 year Guidance for specification option: Pipes. Manufacturer guidanceConsult manufacturer for full details. |
Uniclass | |
CAWS | T90/475 Underfloor heating systems T90/475 Underfloor heating systems |
Specification data - Underfloor low-temperature hot water heating systems
System performance | Guidance for specification option: Insert requirements. |
Heat source | Low-temperature hot water heating system.Guidance for specification option: Specify details separately. |
Pumps | Beneath Heat underfloor heating pump pack.Beneath Heat single area pump pack.Manufacturer guidanceConsult manufacturer for details. |
Pipework | |
Distribution | Guidance for specification option: Insert requirements. |
Underfloor | 16 mm PERT pipes and fittings.16 mm MLCP pipes and fittings.Manufacturer guidanceInstallation tools available, including pipe decoilers, pipe cutters and pipe calibrators. |
Jointing materials | Guidance for specification option: Insert requirements. |
Insulation | Insulation panels, laid between joists.Guidance for specification option: Consult manufacturer's literature for installation details. Manufacturer guidanceConsult manufacturer for details. |
Pipe supports | 40 mm pipe staples at 150 mm centres with dry screed mix (3:1 sand/cement).60 mm pipe staples at 150 mm centres with dry screed mix (3:1 sand/cement).40 mm pipe staples at 200 mm centres with dry screed mix (3:1 sand/cement).60 mm pipe staples at 200 mm centres with dry screed mix (3:1 sand/cement).Manufacturer guidance
|
Valves | Guidance for specification option: Consult manufacturer for options and insert requirements. Options include manifolds, blend valves, heat pump valves and return elbows. |
Water treatment | Guidance for specification option: Consult manufacturer for options and insert requirements or omit. |
Accessories | 230 V Saswell dial thermostat.Guidance for specification option: Consult manufacturer for options and insert requirements. 230 V Saswell programable thermostat.230 V Saswell WiFi thermostat.Wireless Saswell programable thermostat.Wireless Saswell WiFi thermostat.Saswell WiFi gateway |
Controls | |
Controllers | Saswell 230 V two wire actuator.230 V wiring centre.230 V wireless wiring centre. |
Control valves | Saswell two-port motorised valve. |
Sensors | Not required.Saswell floor/ air sensor.Single area pump pack adaptors.Guidance for specification option: Not for use with single area pump pack. |
Floor components | Structural floor deck.Guidance for specification option: Insert details. Specify separately as required. |
Floor covering | Guidance for specification option: Insert details. Specify separately as required. |
Sustainability data
Contains Red List materials | No |
Country of material origin | United Kingdom |
Country of product manufacture | United Kingdom |
Material | Chipboard Guidance for specification option: P5 grade. |
Recyclability | 0 |
Recycled contentAs defined in clause 7.8 of BS EN ISO 14021 | 0 % |
Literature
Beneath Plate 22 mm Foiled Chipboard Over Joists UFH System
Underfloor Heating Product and Technical Guide
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